Basic Info.
Model NO.
WD588AB
Usage
Electronic Components Potting
Type
Liquid Coating
Classification
Double Components Adhesives
Supply Ability
100 Ton/Tons Per Month
OEM
Avaliable
Shelf Life
6 Months
Cure Condition
Room Temperature
Advantage
High Gloss, No Yellow, Crystal Clear, Low Odor, ...
Transport Package
Barrel
Specification
5kg per bottle
Trademark
SWETE
Origin
China
Production Capacity
50000 Kilogram/Kilograms Per Week
Product Description
Products Description
WD588AB is two-component solvent-free type flame retardant room temperature curing epoxy potting adhesive with high thermal conductivity, cured at room or heat temperature.
It's designed for pouring and protecting Auto mobile parts and supply physical strength to the elements, where excellent properties and exceptional thermal shock at elevated temperatures are required.
Electronic potting compound is a kind of two components(5:1 mixing ratio) addition cure Epoxy with the characteristics of heat-conducting , low viscosity , inherent flame resistance ,waterproofing ,etc.
It can cure both at room temperature and heated temperature and the curing time can be accelerated by higher temperature.
Characteristics 
Direction for use
1. Mix the glue: the glue component in the original packaging after the full mixing (no filler can not stir), the A and B components according to the provisions of the quality ratio of mixing (see the table above the mixing ratio), stir even after potting, The time available after mixing is shown in the table above.
More than the available time, glue viscosity will be high, no longer suitable for perfusion. So each time with the amount of plastic should not be too much, otherwise it will cause a waste.
2. Curing: Cure conditions See table above. Curing speed and temperature-related, high temperature fast curing, winter temperature is low, curing time will be extended, a variety of plastic can be used curing curing method, at 80 ºC under the conditions of curing 2 to 3 hours. After the hardening of the glue can be assembled, the test generally need to cure 24 to 48 hours after the curing.
Application
OPERATION PRECAUTION
1. Before using the A component of the compound must be in the original packaging to stir evenly (because the long-term placement may be precipitation, stirring even after use, does not affect performance).
2. Different seasons due to temperature changes in curing speed is different is normal, the winter temperature is low curing will be slower. Above all kinds of plastic can be used heating curing method.
3. Some of the A, B components of the colloid in the low temperature conditions may occur crystallization, agglomeration, which is normal; before use it can be placed in the oven at 80 ºC to melt, and then put to room temperature after use Does not affect its performance.
4. In the mixing process, pay attention to the inner wall of the container must be folded back to the mixing, to ensure the uniformity of plastic. Curing time is affected by temperature, winter can choose to use winter formula.
* Keep away from Children
* Avoid contact with eyes and skin. If contact with your skin, scrub first with soap water or alcohol, then rinse with water. If contact with your eyes, rinse with plenty of water, and seek medical treatment immediately.
* It is forbidden to build on the surface of the wet substrate.
Due to the storage conditions, this product may experience a small amount of precipitation during storage, which is a normal phenomenon. After stirring evenly, it can be used normally.
WD588AB is two-component solvent-free type flame retardant room temperature curing epoxy potting adhesive with high thermal conductivity, cured at room or heat temperature.
It's designed for pouring and protecting Auto mobile parts and supply physical strength to the elements, where excellent properties and exceptional thermal shock at elevated temperatures are required.
Electronic potting compound is a kind of two components(5:1 mixing ratio) addition cure Epoxy with the characteristics of heat-conducting , low viscosity , inherent flame resistance ,waterproofing ,etc.
It can cure both at room temperature and heated temperature and the curing time can be accelerated by higher temperature.
| Name | Epoxy Resin |
| Material | Epoxy Resin and Hardener |
| Epoxy Resin and Hardener | Jewelry, DIY Artwork, Painting, Woodworking |
| Color | Transparent |
| Advantage | Great bonding capability, fast wet out, good flexibility, low odor |
| Delivery Time | 10-20 Days |
Characteristics
High Thermal conductive liquid silicone Epoxy glue electronic potting compound.
Circuit board waterproof adhesive electronic potting sealant silicone epoxy lamps potting sealant manufacturers electronic power LED thermal conductive adhesive.
Circuit board waterproof adhesive electronic potting sealant silicone epoxy lamps potting sealant manufacturers electronic power LED thermal conductive adhesive.
Specification
| PERPORTY | Part A | Part B |
| Colour (Appearance) | Black Viscous Liquid | Brown liquid |
| Viscosity, cps , 25ºC | 30000~40000 | 100~200 |
| Density (g/cm³) (GB/T 15223-1994) | 1.60~1.70 | 1.05~1.15 |
| Mixture ratio (Weight Ratio) | A:B = 5:1 | |
| Viscosity of mixture,4#rotor,cps , 25ºC | 2000~4000 | |
| Operation time,mins , 25ºC | 30-50 | |
| Cure condition | 25ºC/4~6Hrs | |
| Cured appearance | Black Elastomer | |
| Hardness, Shore D | >80 | |
| Thermal conductivity,W/K.T | 0.5 | |
| Shear strength, Fe-Fe, MPa | >10 | |
| Dielectric loss angle tangent,1.2MHz | <0.01 | |
| Volume resistance,DC 500V, Ω·CM | 1.1×1014 | |
| Breakdown voltage,kV/mm,25ºC | >18 | |
| Cure shrinkage,% | <2 | |
| Dielectric constant(1 MHz) | 3.3±0.1 | |
| Application temperature, ºC | - 40 - 120 | |
| Flame resistance ( UL-94) | V-0 | |
Direction for use
1. Mix the glue: the glue component in the original packaging after the full mixing (no filler can not stir), the A and B components according to the provisions of the quality ratio of mixing (see the table above the mixing ratio), stir even after potting, The time available after mixing is shown in the table above.
More than the available time, glue viscosity will be high, no longer suitable for perfusion. So each time with the amount of plastic should not be too much, otherwise it will cause a waste.
2. Curing: Cure conditions See table above. Curing speed and temperature-related, high temperature fast curing, winter temperature is low, curing time will be extended, a variety of plastic can be used curing curing method, at 80 ºC under the conditions of curing 2 to 3 hours. After the hardening of the glue can be assembled, the test generally need to cure 24 to 48 hours after the curing.
Application
OPERATION PRECAUTION
1. Before using the A component of the compound must be in the original packaging to stir evenly (because the long-term placement may be precipitation, stirring even after use, does not affect performance).
2. Different seasons due to temperature changes in curing speed is different is normal, the winter temperature is low curing will be slower. Above all kinds of plastic can be used heating curing method.
3. Some of the A, B components of the colloid in the low temperature conditions may occur crystallization, agglomeration, which is normal; before use it can be placed in the oven at 80 ºC to melt, and then put to room temperature after use Does not affect its performance.
4. In the mixing process, pay attention to the inner wall of the container must be folded back to the mixing, to ensure the uniformity of plastic. Curing time is affected by temperature, winter can choose to use winter formula.
* Keep away from Children
* Avoid contact with eyes and skin. If contact with your skin, scrub first with soap water or alcohol, then rinse with water. If contact with your eyes, rinse with plenty of water, and seek medical treatment immediately.
* It is forbidden to build on the surface of the wet substrate.
Due to the storage conditions, this product may experience a small amount of precipitation during storage, which is a normal phenomenon. After stirring evenly, it can be used normally.
