Potting Compounds for Electronic Components Epoxy Resin Ab Glue for Electronic Potting High Temperature Epoxy Resin

CAS No.: 38891-59-7
Formula: C15h16o2c2h7onc3h5ocl
EINECS: 231-072-3
Molecular Principal Chain: Carbon Chain Polymer
Color: Black
Appearance: Clear

Products Details

Basic Info.

Model NO.
WD588AB
Mixing Ratio
5:1
Usage
Construction, Fiber & Garment, Footwear & Leather.
Certificate
RoHS, Reach, PAHs, ASTM, En-71
Type
Liquid Glue
Classification
Double Components Adhesives
Supply Ability
100 Ton/Tons Per Month
OEM
Avaliable
Shelf Life
6 Months
Cure Condition
Room Temperature
Advantage
Bubble Free and Self Leveling
Transport Package
Barrel
Specification
5kg per bottle
Trademark
SWETE
Origin
China
Production Capacity
50000 Kilogram/Kilograms Per Week

Product Description

Products Description


Potting Compounds for Electronic Components Epoxy Resin Ab Glue for Electronic Potting High Temperature Epoxy Resin

Feature

Epoxy resin WD588AB is a black epoxy potting resin, can be cured under normal temperature and low temperature, with good flowing property, natural defoaming, it can also be cured at high temperature.

Potting Compounds for Electronic Components Epoxy Resin Ab Glue for Electronic Potting High Temperature Epoxy Resin

Application

WD588AB can be widely used for electronics potting, power encapsulation, mold filling and the insulation of other electronic
components, moisture proof,confidential encapsulation, etc.


Potting Compounds for Electronic Components Epoxy Resin Ab Glue for Electronic Potting High Temperature Epoxy Resin

Properties before Hardening
 
 
Part
WD588A
WD588B
Color
Black
Red black
Specific gravity
1.65
0.96
Viscosity (25ºC)
1500-4000CPS
500-2000CPS
Mixing ratio
A: B = 100:20(weight ratio)
Hardening conditions
25 ºC×8H to 10H or 55ºC×2H (2 g)
Usable time
25ºC×40min (100g)


Operation

1.Weigh A and B glue according to the given weight ratio into the prepared cleaned container, fully mixed the mixture again the container wall by clockwise, place it along for 3 to 5 minutes, and then it can be used.

2.Take the glue according to the usable time and dosage of mixture to avoid wasting. When the temperature is below 15 ºC, please heat A glue to 30 ºC first and then mix it to the B glue (A glue will be thicken in low temperature ); The glue must be sealed lid after use to avoid rejection caused by moisture absorption.

3.When the relative humidity is higher than 85%, the surface of the cured mixture will absorb moisture in the air, and form a
layer of white mist in the surface, so when the relative humidity is higher than 85%, is not suitable for room temperature curing,suggest to use the heat curing.


Potting Compounds for Electronic Components Epoxy Resin Ab Glue for Electronic Potting High Temperature Epoxy Resin

Properties after Hardening
 
Hardness, shore D
<78
Withstand voltage, KV/mm
22
Flexural strength, Kg/mm2
23
Volume resistivity, Ohm3
1x1015
Surface resistance, Ohmm2
5X1015
Thermal conductivity, W/M.K
0.60
Induced electric loss, 1KHZ
0.42
Withstand high temperature, ºC
140
Moisture absorption, %
<0.15
Compressive strength, Kg/ mm2
11.3


Mixing Ratio

5:1


Caution

1,The operating environment should be ventilate and should keep away from fire. Closely sealed after use. 
2, Avoid eye contact, in case of contact, wash with plenty of water and get medical attention immediately.
3, If contact skin, wrap with clean cloth or paper, and wash it with water and soap.
4, Keep away from children.
5, Please take a trial before application to avoid usage mistake.


Storage And Shelf Life

1, Store at the tempestuous of 25°C or cool and dry place. Avoid from sunlight, high temperature or high humidity environment. 
2, Use up as soon as possible when opened. It is strictly forbidden to expose to the air for a long time after it is opened to
avoid affecting the quality of the products. The shelf life is six months in the room temperature of 25°C. 



MEASURING

With gloves on, pour equal amounts of resin and hardener into a mixing cup. And then pouring the mixture into another clean mixing cuo to make sure you are mixing it well.

TIP - Mix up a little more than you think you'll need because you want to completely cover your work in one shot and not have to mix more later.



MIXING

Stir really well for at least 3 minutes. Scrape the sides and the bottom to make sure you're being thorough (unmixed material will leave you with sticky spots that just won't cure). Once you put the resin and hardener together, you'll have about 40 minutes of working time before the resin thickens and cures.



POURING

After making sure your piece is level, go ahead and pour AmazingResin over your work. Don't be scared! It'll start to level on its own, and you can spread it around into place. Let the resin run over the edges and then just use a brush to tidy it up. You'll notice bubbles will begin to rise to the surface. Many of these will pop on their own, but you can also pop them by torch.

TIP - Wooden panels work best for large pieces rather than canvas because they won't sag under the weight of the resin.

WAIT AmazingResin needs to sit for several hours in a dust-free space while it cures. In about 8 hours it will be tacky but you will be able to pour a second coat if necessary. In about 12 hours it will be dry to the touch, and within 24 hours it will be 95% cured. It will be fully cured within 72 hours. CLEAN UP - To reuse your mixing tools, wipe them down with a paper towel before the resin dries.


Package

5kgs per bottle and 20kgs per set, 20kgs, 25kgs and 200kgs also available.


Storage Conditions

The product should be sealed in its original packaging container and stored in a dry and ventilated place. In an environment of 18-40ºC, the shelf life is 6 months. If the shelf life is exceeded, analysis is required to determine whether it is still valid.

Due to the storage conditions, this product may experience a small amount of precipitation during storage, which is a normal phenomenon. After stirring evenly, it can be used normally.


Potting Compounds for Electronic Components Epoxy Resin Ab Glue for Electronic Potting High Temperature Epoxy Resin

Potting Compounds for Electronic Components Epoxy Resin Ab Glue for Electronic Potting High Temperature Epoxy Resin



Potting Compounds for Electronic Components Epoxy Resin Ab Glue for Electronic Potting High Temperature Epoxy Resin

Potting Compounds for Electronic Components Epoxy Resin Ab Glue for Electronic Potting High Temperature Epoxy Resin

Potting Compounds for Electronic Components Epoxy Resin Ab Glue for Electronic Potting High Temperature Epoxy Resin
Due to the storage conditions, this product may experience a small amount of precipitation during storage, which is a normal phenomenon. After stirring evenly, it can be used normally.

Potting Compounds for Electronic Components Epoxy Resin Ab Glue for Electronic Potting High Temperature Epoxy Resin

Potting Compounds for Electronic Components Epoxy Resin Ab Glue for Electronic Potting High Temperature Epoxy Resin
Potting Compounds for Electronic Components Epoxy Resin Ab Glue for Electronic Potting High Temperature Epoxy Resin

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