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Basic Info.
Product Description
Heat Dissipation and Heat Conduction Silica Gel Materials for Electronic Products Can Be Customized as Heat Dissipation Materials
No matter use what kind of cooling device, if there is a poor fit between electronic components and cooling devices, it will have a lot of air block heat transmission between components. The cooling device will not be able to effectively reduce the heat of electronic components.
This series of products have very good thermal conductivity and filling properties, its softness, elastic characteristics can fill the gap well between heating component and the heat dissipation module, the gap between the metal body and chassis , fast heat dissipation, to promote the work efficiency of components, to extend the service life of equipment.
2.Soft and high compressibility, vibration shock absorber.
3.Self-adhesive.
4.Easy construction.
5.Electrical insulation
6.Complies ROHS and UL environmental requirements.
7.Provide a variety of thickness to choose.
Application:
Integrated circuits, CPU, graphics processing chip, power electronic capacitors, crystal.Diode lights,power supply module, server, the hard disk.Plasma displays, LCD monitor, tablet computers,desktop computers, communications equipment, router.Memory module, video player, smart phone
In terms of thermal conductivity, shape, and size, we can customize according to customers' needs to meet the requirements of different devices and application scenarios. Whether you wish for a specific hardness of the silicone pad, or need a silicone pad of a particular shape and size, we have the capability to provide you with a fitting solution.
| General Product Attribute Table | ||||||
| Color | - | Blue | Light blue+Yellow | Visual | ||
| Project | Unit | GC-TP-150A | GC-TP-200A6 | GC-TP-200A | GC-TP-200E6 | Testing Standard |
| Hardess | Shore oo | 40±5 | 25±5 | 45/55 ±5 | 25±5 | ASTM D2240 |
| Thickness | mm | 0.5~50 | 0.5~50 | ASTM D374 | ||
| Density | g/cm3 | 2.1±0.2 | 2.4±0.2 | 2.4±0.2 | ASTM D792 | |
| Thermal Conductive | W/m.k | 1.5±0.2 | 2±0.2 | 2.0±0.2 | ASTM D5470 | |
| Size | mm | Customizable | - | |||
| Thermogravimetric Loss | % | <1.0 | @150ºC/24H | |||
| Tensile Strength | MPa | 0.08-0.32 | ASTM D412 | |||
| Volume Resistivity | Ω.cm | 1.0*1013 | ASTM D257 | |||
| Dielectric Strength | KV/mm | >6 | ASTM D149 | |||
| Flame Rating | - | V-0 | UL94 | |||
| Temperature Range | ºC | -40~200 | - | |||
