Epoxy Resin Compound Epoxy Resin Potting Compound for Circuit Board

Molecular Principal Chain: Carbon Chain Polymer
Color: Color-Tunable
Appearance: Black Viscous Liquid (Color-Tunable)
Density: 1.70-1.85
Viscosity: 1000-3500
Glass Transition Temperature: 45-75

Products Details

Basic Info.

Model NO.
WD9202A002
Linear Expansion Coefficient
48-65
Thermal Conductivity
0.40-0.65
Insulation Strength
15-21
Dielectric Constant
Less Than or Equal to 4.2
Volume Resistivity
Greater Than or Equal to 1.0X1015
Water Absorption
Less Than or Equal to 1.0
Transport Package
Barrel
Specification
25kg, or customized available
Trademark
SWETE
Origin
China
Production Capacity
50000tons Per Year

Product Description

There are many varieties of epoxy resin potting sealant in potting sealant, and the scope of application is wide, especially in terms of technical requirements. Therefore, in terms of curing, it can be divided into two types : room temperature curing and heating curing. Whether it is mechanical potting or artificial potting, it can achieve the characteristics of protecting electrical parts after curing, especially the superior waterproof, moisture-proof and corrosion resistance.

Epoxy Resin Compound Epoxy Resin Potting Compound for Circuit Board

Uses 
Suitable for capacitor, igniter, transformer, aquarium pump, drive power, sensor and other electronic products insulation waterproof package.
 Epoxy Resin Compound Epoxy Resin Potting Compound for Circuit Board

Characteristics 
Good insulation performance, good physical properties, excellent surface gloss, good processability and good crack resistance.

Test datas,as bellow:
I.Appearance
Main agent A: Black viscous liquid (Color-Tunable)
Curing agent B: Brown liquid
II.Density(Density (25ºC) g/cm³
Main agent A: 1.70-1.85
Curing agent B: 1.03-1.12
III.Viscosity (40ºC, mPa.s)
Main agent A: 1000-3500
Curing agent B: 15-35

Property after curing (25ºC, 5-6 hours curing)

IV.Glass Transition Temperature (ºC): 45-75
V.Linear Expansion Coefficient(ppm/k, lower than the average of Tg ): 48-65
VI.Water Absorption(%, 100ºC/24h): ≤1.0
VII.Thermal Conductivity (W/mK): 0.40-0.65
VIII.Insulation Strength (KV/mm): 15-21
IX.Dielectric Constant (50Hz) : ≤4.2
X. Volume Resistivity (Ω/cm) : ≥1.0x1015

Ration
100:80-20

Package
Component A: 25kg /barrel
Component B: 5kg /barrel

Epoxy Resin Compound Epoxy Resin Potting Compound for Circuit Board
Epoxy Resin Compound Epoxy Resin Potting Compound for Circuit Board
Epoxy Resin Compound Epoxy Resin Potting Compound for Circuit BoardEpoxy Resin Compound Epoxy Resin Potting Compound for Circuit Board
Storage Conditions
The product should be sealed in its original packaging container and stored in a dry and ventilated place. In an environment of 18-40ºC, the shelf life is 6 months. If the shelf life is exceeded, analysis is required to determine whether it is still valid.

Epoxy Resin Compound Epoxy Resin Potting Compound for Circuit Board

Epoxy Resin Compound Epoxy Resin Potting Compound for Circuit Board

Epoxy Resin Compound Epoxy Resin Potting Compound for Circuit Board
Due to the storage conditions, this product may experience a small amount of precipitation during storage, which is a normal phenomenon. After stirring evenly, it can be used normally.

Epoxy Resin Compound Epoxy Resin Potting Compound for Circuit Board

Epoxy Resin Compound Epoxy Resin Potting Compound for Circuit Board
Epoxy Resin Compound Epoxy Resin Potting Compound for Circuit Board

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